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High-performance AI chips for on-device and on-premises AI

We accelerate the future of AI to create a safer and more convenient world.

Powerful and versatile solutions to meet all
your edge needs

Mobilint provides NPU solutions optimized for AI tasks at the edge.
It can achieve high performance even at low power and can perform various AI algorithm operations, significantly improving the performance of your edge products. Our NPU solution is not only affordable in terms of price and maintenance, but also easy to use with full-stack SDK support.

Fast and efficient

High performance of up to 80 TOPS and high power-efficiency

Easy to use

Easy to develop with a user-friendly full-stack SDK

High versatility

Support most ML frameworks and over 300 algorithm models

Reliable scalability

Provide a linear increase in performance and power efficiency

World’s Best AI Accelerator for Edge HPC Solutions

The fastest and easy-to-use NPU solution for a high-performance edge AI with a full-stack SDK and technical support.

MLA100

Edge NPU PCIe Card

  1. The world’s leading AI performance edge NPU solution

  2. High versatility with support for 300+ AI algorithm models

  3. Easy-to-use and intuitive interface for quick development

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MLX-A1

Standalone AI Box

  1. Complete Edge HPC board for most edge AI applications

  2. Support a variety of interfaces including MIPI, USB, and Ethernet

  3. Specialized in parallel processing of the latest AI algorithm models

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Founding member of MLCommons

MLCommons is the creator behind the leading ML benchmark, MLPerf.

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Latest AI news

Press Release

Mobilint Wins CES Innovation Award with...

Dec 11, 2024

Mobilint wins CES Innovation Award 2025

Read more news

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Press Release

Mobilint launches new AI chip to optmize deep learning inference

Fab 25, 2025

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Press Release

Daegu City Partners with Six AI Chip Leaders to Drive Regional Innovation

Jul 24, 2024

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Press Release

Mobilint and SemiFive Launch Mass Production of Next-Gen AI Chip 'ARIES'

Mar 28, 2024

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Press Release

Mobilint Listed Among Top 10 AI Innovators in 180:1 Competition

Jun 29, 2023

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Press Release

Mobilint Honored with Minister of Science and ICT Award for AI Chip...

Apr 20, 2023

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Press Release

Hyvision System and Mobilint Sign Strategic MOU to Shape the Future...

Jan 17, 2023

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Press Release

Mobilint Signs MOU with Gwangju City
 

Jan 25, 2025

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Press Release

Mobilint Showcases ‘Regulus’, Its On-Device AI SoC, at AI & Big Data Show

Jun 21, 2024

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Interview

Mobilint CEO Dongjoo Shin on Why NPU Technology Is Only Getting Started

Mar 04, 2024

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Interview

Mobilint CEO Dongjoo Shin on Pioneering Edge AI with Breakthrough Hardware

Apr 23, 2023

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Press Release

Autonics Joins Forces with Mobilint to Advance AI Semiconductor Innovation

Mar 23, 2023

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